Part #HANDYFLOW18X1LB
Product Description
0.125" x 0.05" x 20', 6% Silver, 88% Copper, 6% Phosphorus, Light Copper, Solid, Solder Alloy (28 Rod per Pack)
Part #HANDYFLOW18X1LB
Product Description
0.125" x 0.05" x 20', 6% Silver, 88% Copper, 6% Phosphorus, Light Copper, Solid, Solder Alloy (28 Rod per Pack)
- Brand
Lucas-Milhaupt
Filler Metal6 Percent Silver, 88 Percent Copper, 6 Percent Phosphorus
Melting Temperature1190 Deg F (Solidus), 1460 Deg F (Liquidus)
Metal Used OnCopper to Copper, Copper to Brass
Packaging TypeCase
Shipping Weight25.000 Pound
TypeSolid